Chip Lead
Business Line Description
•
AI & Chip Engineering team defines and develops System on Chip, ASIC’s, Digital and Analog IP’s for a wide range of products, including Automotive microprocessors, Application processors, Data Center and network processors.
Job Summary
•
Lead product execution for Automotive ASIL-B/D SoC’s & Data Center SOCs
•
Work with Systems, Marketing, PE/TE and Arch engineering to define the part. Generate and analyze data to take right and cost effective architecture decision
•
Work with IP, Technology, packaging partners to assess the right IP/packages and technology options for the part.
•
Work with IP and SoC functions (frontend, verification, AMS, DFT, Emulation, Validation, Physical implementation) to understand and resolve inter/intra functional handoff and challenges.
•
Oversee definition management and make sure the implementation complies with the requirements
•
Work closely with downstream teams dependent on SOC, who are working on post-silicon activities, to make sure their needs are addressed
•
Work closely with Test and Product engineering teams to enable productization.
•
Work closely with post silicon evaluation teams (functional and analog Validation, Characterization, Application and Software teams) and address design issues.
•
Work with Program management office for management attention and clearly articulate dependencies and help needed for timely execution of projects.
•
Assess workload and resource demands based on complexity and create predictable project plans meeting customer requirements
•
Mentor engineers across various functions
Key Challenges
•
Automotive SoC development pose additional challenges specific to implementation of safety mechanism
•
Automotive SoC development requires ensuring very high quality and reliability, ensuring a very low ppm defectivity over an long product life time.
•
The role includes leading the teams in a matrix organization, assimilating information from across functional teams and analyzing it in product context
•
Understand impact of architecture on logical and physical realizability
•
Working within resource and schedule constraints
Cross functional aspects
•
This role is primarily about leading cross functional teams
•
During part definition is includes a close interaction with Business, Systems, Architects, third party IP vendors
•
During execution a close interaction and decision making is required between Technology, packaging, IP, Architecture, Various implementation functions, Test and Product Engineering.
•
Post silicon, close collaboration is needed with Software, Test and production engineering, Application and Field teams.
•
Overall, Chip lead is central design point of contact for all cross functional teams associated with the part.
Job Qualifications
•
Bachelors in Engineering with at 15 years of design development experience, with at least 5 years of leading complete design and design functions.
•
MS in Electrical Engineering preferred (higher level education may substitute for some experience).
•
Experience in leading Global cross functional teams
•
Experience in leading designs in smaller geometries desired
Job location
•
The role is based in Austin/US. This is a hybrid role with a few days in the office each week and the remaining days are work from home.
More information about NXP in the United States...
NXP is an Equal Opportunity/Affirmative Action Employer regardless of age, color, national origin, race, religion, creed, gender, sex, sexual orientation, gender identity and/or expression, marital status, status as a disabled veteran and/or veteran of the Vietnam Era or any other characteristic protected by federal, state or local law. In addition, NXP will provide reasonable accommodations for otherwise qualified disabled individuals.