Principal Process Engineer, Die Bonding
Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.The Advanced Packaging Technology Development (APTD) department at Micron Technology is at the forefront of innovation, driving the advancement of memory and storage Interconnects and Packaging solutions that transform how the world uses information. Micron is dedicated to developing innovative processes and technologies that enable the creation of next-generation semiconductor products which drive the AI revolution. By collaborating closely with our global R&D, equipment and materials suppliers, and manufacturing teams, we ensure the efficient development, transfer and implementation of new technology nodes, maintaining Micron's leadership in the industry.As a Principal Process Engineer in Die Bonding, you will be primarily responsible for starting up, developing, and optimizing processes to improve product quality and reliability, working on process yield improvement, cost reduction, productivity improvement, and risk management as well as resolving manufacturing line problems. You will also be required to identify, diagnose and resolve assembly process related problems by applying failure analysis, FMEA, 8D or SPC/FDC methodology.Responsibilities:Develop, diagnose, and resolve various die bonding process technologiesCoordinate and manage process, equipment, and material evaluation/optimization initiatives and implement changes at process stepLead and participate in continuous yield improvement and cost reduction activitiesValidate and fan out new process baseline qualified, including new process, tools and/or materials for new product introductionManage, audit, and be a liaison with material suppliers to achieve quality, cost, and risk management objectivesSupport SPC/FDC/RMS/APC and site-to-site portabilitySupport internal and external auditsMinimum Qualifications:A BS degree with minimum 8+ years proven experience in Semiconductor Process EngineeringSolid engineering knowledge of semiconductor advanced packaging die stacking processesSkilled at designing valid tests and Design of Experiments (DOE)Excellent data collection, organization, and analysis skills, plus proficiency in data analysis techniques/programsKnowledge and an understanding of project management and experience leveraging AI to design experimentsPreferred Qualifications:Masters or Doctorate degree in Engineering, Physics, or related field5+ years experience in working on Die Bonding in Advanced Packaging settings; Fusion Bonding, Hybrid Bonding, Direct Bonding, or on applications such as MEMS, Imager, Memory or Heterogeneous IntegrationBonding experience at a Vendor, Research Institute, or Semiconductor Industry Equipment Supplier or IntegratorExcellent oral and written comm...